Microprocessor Forum
Tuesday October 16th

Conference

Keynote:
Throughput Computing
Greg Papadopoulos, Executive Vice President & CTO, Sun Microsystems

Session 1:
PC & Server Processors
Kevin Krewell, General Manager, MDR

Transmeta x86 Technologies & Roadmap
David R. Ditzel, CoFounder and CTO, Transmeta Corporation

Two New VIA Processors with Unique Features
Glenn Henry, President, Centaur Technology, VIA-Centaur

SPARC64 VI: Fujitsu's Next Generation Processor
Takumi Maruyama, Manager, E Processor Development, Fujitsu

IBM POWER5 Processor
Dr. Balaram Sinharoy, POWER5 Chief Scientist, IBM Corporation

Sun Microsystems' UltraSPARC IV Processors
Quinn A. Jacobson, Chief Architect of UltraSPARC IV Series, Sun Microsystems

Session 2:
Extreme Processors
Tom Halfhill, Senior Analyst, In-Stat/MDR

A New, High-performance, Low-Power, Floating-Point Embedded Processor for Scientific Computing and DSP Applications
Simon McIntosh-Smith, Director of Architecture, ClearSpeed Technology Ltd.

Field-Programmable Object Array (FPOA), a 1 GHz Processor for Signal and Network Processing
Dirk Helgemo, Chief Architect, MathStar, Inc.

New StarCore DSP Bridges the Gap Between General Purpose Computing & Signal Processing
Zvika Rozenshein, Director, DSP Platforms Technology Center, Motorola, Inc.

Superpipelined Trimedia CPU
Jan-Willem Van de Waerdt, Chief Architect, Embedded Processor Dept., Philips Semiconductors

A Massively Parallel Processor Array for Communications
Peter Claydon, COO, Cofounder & Chief Architect, picoChip Designs Ltd.

A Massively Parallel Reconfigurable ULIW Core
Dr. Ir. Jeroen A.J. Leijten, Cofounder & Lead Architect, Silicon Hive

16th Annual Microprocessor Report Awards
Nick Tredennick, Editor, Dynamic Silicon

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