This technology brief provides an analysis of a new trend in Semiconductor Manufacturing. Chartered Semiconductor Manufacturing, IBM and Samsung have now developed a new model that addresses both the cost of fab capacity and process development, while providing a cohesive design ecosystem through what has been named Common Platform™ technology. They have extended their joint bulk CMOS development alliance to include joint manufacturing capability.

The Common Platform technology partners have generated a number of new benefits for clients, including:

• Full product development, manufacturing, and product lifecycle support from three leaders in semiconductor design, process technology, and manufacturing
  
  
• Multi-sourcing a single design through GDSII compatibility to globally-diverse synchronized fabs for risk mitigation and/or upside support
  
  
• Choice of design enablement resources (libraries, IP, reference flows, EDA tools, and packaging), including a robust set of Design for Manufacturing (DFM) tools jointly supported by multiple tool vendors, design centers, and foundry partners
  
  
• Engineering services and support from three companies with expertise in every aspect of semiconductor design and manufacturing

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