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AdvancedTCA Market Slowly Builds Momentum |
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Open Standards Chassis
(OSCs) are nothing new. They have been around
since the mid 1980s. Standards such as VMEbus
and CompactPCI have met with varying levels
of success over the years. However, now with
the advent of the AdvancedTCA, there is a
renewed sense of interest in the potential
for using standardized chassis in more places.
Part of that enthusiasm has spurred splintering
standards such as the CompactTCA and the MicroTCA.
Plus, IBM has taken a page from the PICMG
playbook and is working on making its BladeCenter
an open standard. When you combine all of
these various OSCs together, we find that
they currently garner about 1.5% of the overall
CapEx equipment market. However, this penetration
rate can, and will improve. By 2009, the overall
market will be over $12 billion, between all
the various forms of OSCs.
In addition, this strong growth will
help generate the volumes needed to bring
economies of scale to the AdvancedTCA market,
allowing it to penetrate other industries,
such as Military, Medical/Industrial, and
finally the coveted Enterprise market. All
of these other markets will help the AdvancedTCA
surpass its communications only revenue by
an additional 47%.
This report has forecasts for each of
the major types of OSCs in the communications
markets, plus an extended forecast for the
AdvancedTCA in all of its potential market
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- Executive Summary
- Methodology &
Definitions
- Introduction
- Technical Overview
- Market Overview
- Forecasts
- Technical Overview
- Network Equipment
Building Standards (NEBS)
- VMEbus
- CompactPCI
- CompactPCI Packet
Switching Backplane
- CompactPCI Serial
Mesh Backplane
- AdvancedTCA
- Backplane Options
- Advanced Mezzanine
Cards
- Rear Transition
Modules
- CompactTCA
- MicroTCA
- BladeCenter (IBM)
- Fundamental Dimensions
- Backplane Options
- Strengths
- Weaknesses
- Which Chassis Will
Win?
- Market Overview
- Market Drivers
- OSCs and Merchant
Networking Silicon
- From a NEP’s
Perspective
- From a Service
Provider’s Perspective
- The Proprietary
Disadvantage
- OSC Forecast
- Table 1. Partial
List of Topics Covered by the NEBS Criteria
- Table 2. A
Comparison of the Key Dimensions for PICMG 3.0 versus PICMG 2.0
- Table 3. Aggregate
Backplane Capacities for a Full Mesh AdvancedTCA Backplane
- Table 4. Aggregate
Backplane Capacities for a Dual Star AdvancedTCA Backplane
- Table 5. Future
Capacities for the AdvancedTCA Due to SerDes Improvements
- Table 6. Key
Dimensions for the BladeCenter Chassis
- Table 7. Key
Dimensions for a BladeCenter Board
- Table 8. Hourly,
Full-Duplex Data Consumption Rates for Popular Online Activities
- Table 9. Standardized
Chassis Revenue Forecast, 2004 – 2009 ($M)
- Table 10. Standardized
Chassis Revenue Forecast, 2004 – 2009 ($M)
- Table 11. AdvancedTCA
Revenues in Various Market Segments, 2004 – 2009 ($M)
- Figure 1. Revenue
Forecast for the OSCs Market ($B)
- Figure 2. Logical
Depiction of the CompactPCI Packet Switch Backplane (PICMG 2.16)
- Figure 3. Logical
Depiction of the CompactPCI Serial Mesh Backplane (PICMG 2.20)
- Figure 4. A Pictorial
Comparison of the Key Differences between PICMG 3.0 and 2.0
- Figure 5. Isometric
Drawing of the AdvancedTCA (PICMG 3.0) with Key Dimensions
- Figure 6. Logical
Depiction of GigE Mesh Backplane for the AdvancedTCA
- Figure 7. Logical
Depiction of a Dual Star Switch Backplane for the AdvancedTCA
- Figure 8. Physical
and Logical Layout of a Backplane Connector for the AdvancedTCA
- Figure 9. All of
Zone 2 Connectors for the AdvancedTCA Backplane
- Figure 10. Graphical
Depiction of How the AMCs and RTMs Relate to the AdvancedTCA
- Figure 11. How
to Enhance Modularity of the AdvancedTCA with AMCs and RTMs
- Figure 12. Front-Side
Picture of IBM’s BladeCenter Chassis
- Figure 13. Rear-View
Picture of IBM’s BladeCenter Chassis
- Figure 14. Logical
Depiction of a Dual-Star Switch Backplane for the AdvancedTCA
- Figure 15. An Example
of How TBSs Can Reduce OpEx and Increase Revenues
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